Intel Announces Lakefield Core-i3 and i5 Processors
June 11, 2020
(Credit: Intel Corporation)
Intel has just launched two new processors with Intel Hybrid Technology, called Lakefield. They use the company’s Foveros 3D packaging technology. It is claimed that these chips are the smallest ones to deliver Intel Core performance and full Windows compatibility.
This packaging method is so compact that the entire chip is only 12x12x1 mm. Two logic dies and two layers of DRAM are stacked in a three dimensional layout, negating the need for external memory. Besides this, it also supports:
- Hardware-guided OS scheduling
- More than 2x throughput on Intel UHD for AI-enhanced workloads
- Up to 1.7x better graphics performance
- Gigabit connectivity
Aimed at lightweight laptops and small form factor PCs, the new design is said to have 56% smaller package area and about 47% smaller board size and battery life. Intel believes that these attributes will offer better flexibility for dual and foldable screen devices.
The Core i3 and i5 Lakefield chips are the first in the product line up to ship with attached package-on-package (PoP) memory, and feature native dual internal display pipes. They are also said to only draw 2.5mW when idle, which is about a 91% reduction compared to Y-series chips.
According to Intel, the Lenovo ThinkPad X1 Fold and Samsung Galaxy Book S will be the first two laptops to feature these Lakefield chips. And we will let you know more about them, once we’ve had a chance to test these devices.
